Study of signal integrity and radiated emission of single ended and differential high speed digital signals crossing a slot
With increasing board complexity and operating frequencies, signal integrity (SI) and radiated emission (RE) compliance for high speed digital board is becoming a challenge to printed circuit board (PCB) designers. Together with higher routing density and multiple on-board power supplies, routing tr...
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| Main Authors: | , , , , , |
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| Other Authors: | |
| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2013
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/99128 http://hdl.handle.net/10220/12789 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | With increasing board complexity and operating frequencies, signal integrity (SI) and radiated emission (RE) compliance for high speed digital board is becoming a challenge to printed circuit board (PCB) designers. Together with higher routing density and multiple on-board power supplies, routing traces across split planes are unavoidable. In this paper, SI performance and RE of single ended (SE) and differential signals propagating across slots are studied. Using both experimental and numerical simulation approaches, the impacts of single ended and differential high speed digital signals across a split plane are investigated and analysed. |
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