APA استشهاد

Pey, K., Tung, C., Tang, L., Ranjan, R., Radhakrishnan, M., Lin, W., . . . MICROELECTRONICS, I. O. (2014). Structural analysis of breakdown in ultrathin gate dielectrics using transmission electron microscopy.

استشهاد بنمط شيكاغو

Pey, K.L., C.H Tung, L.J Tang, R. Ranjan, M.K Radhakrishnan, W.H Lin, S. Lombardo, F. Palumbo, و INSTITUTE OF MICROELECTRONICS. Structural Analysis of Breakdown in Ultrathin Gate Dielectrics Using Transmission Electron Microscopy. 2014.

MLA استشهاد

Pey, K.L., et al. Structural Analysis of Breakdown in Ultrathin Gate Dielectrics Using Transmission Electron Microscopy. 2014.

تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.