Modeling delamination migration in cross-ply tape laminates

• Main Authors: De Carvalho N.V., Chen, Boyang, Pinho S.T., Ratcliffe J.G., Baiz P.M., Tay, Tong-Earn
• Other Authors: MECHANICAL ENGINEERING
• Format: Article
• Published: Elsevier 2016
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/123363
• Institution: National University of Singapore

Composites Part A: Applied Science and Manufacturing