New Approaches to Micro-Electronic Component Cooling

Ph.D

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Bibliographic Details
Main Author:	WANG XIANGQI
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	thermal management; micro-electronic devices; tree-shaped net; phase change materials; nanofluids
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/13123
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Institution:	National University of Singapore
Language:	English

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spelling	sg-nus-scholar.10635-131232017-10-21T10:04:45Z New Approaches to Micro-Electronic Component Cooling WANG XIANGQI MECHANICAL ENGINEERING ARUN SADASHIV MUJUMDAR YAP, CHRISTOPHER ROBERT thermal management; micro-electronic devices; tree-shaped net; phase change materials; nanofluids Ph.D DOCTOR OF PHILOSOPHY 2010-04-08T10:30:14Z 2010-04-08T10:30:14Z 2007-12-26 Thesis WANG XIANGQI (2007-12-26). New Approaches to Micro-Electronic Component Cooling. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/13123 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	thermal management; micro-electronic devices; tree-shaped net; phase change materials; nanofluids
spellingShingle	thermal management; micro-electronic devices; tree-shaped net; phase change materials; nanofluids WANG XIANGQI New Approaches to Micro-Electronic Component Cooling
description	Ph.D
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING WANG XIANGQI
format	Theses and Dissertations
author	WANG XIANGQI
author_sort	WANG XIANGQI
title	New Approaches to Micro-Electronic Component Cooling
title_short	New Approaches to Micro-Electronic Component Cooling
title_full	New Approaches to Micro-Electronic Component Cooling
title_fullStr	New Approaches to Micro-Electronic Component Cooling
title_full_unstemmed	New Approaches to Micro-Electronic Component Cooling
title_sort	new approaches to micro-electronic component cooling
publishDate	2010
url	http://scholarbank.nus.edu.sg/handle/10635/13123
_version_	1681078803921633280

New Approaches to Micro-Electronic Component Cooling

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