IMPACT OF FERROMAGNETIC IRON MICRO-SEED IN SAC305 SOLDER AND SOLDER JOINT FORMATION FOR MICROELECTRONIC PACKAGING
Master's
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2017
|
| Subjects: | |
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/136799 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | National University of Singapore |
| Language: | English |
| id |
sg-nus-scholar.10635-136799 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-1367992024-10-25T22:12:34Z IMPACT OF FERROMAGNETIC IRON MICRO-SEED IN SAC305 SOLDER AND SOLDER JOINT FORMATION FOR MICROELECTRONIC PACKAGING ARUN KUMAR SESURAJ PHYSICS TOK ENG SOON RAMANATHAN MAHENDIRAN SAC (SnAgCu) Master's MASTER OF SCIENCE 2017-10-05T18:00:10Z 2017-10-05T18:00:10Z 2017-04-13 Thesis ARUN KUMAR SESURAJ (2017-04-13). IMPACT OF FERROMAGNETIC IRON MICRO-SEED IN SAC305 SOLDER AND SOLDER JOINT FORMATION FOR MICROELECTRONIC PACKAGING. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/136799 NOT_IN_WOS en |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| language |
English |
| topic |
SAC (SnAgCu) |
| spellingShingle |
SAC (SnAgCu) ARUN KUMAR SESURAJ IMPACT OF FERROMAGNETIC IRON MICRO-SEED IN SAC305 SOLDER AND SOLDER JOINT FORMATION FOR MICROELECTRONIC PACKAGING |
| description |
Master's |
| author2 |
PHYSICS |
| author_facet |
PHYSICS ARUN KUMAR SESURAJ |
| format |
Theses and Dissertations |
| author |
ARUN KUMAR SESURAJ |
| author_sort |
ARUN KUMAR SESURAJ |
| title |
IMPACT OF FERROMAGNETIC IRON MICRO-SEED IN SAC305 SOLDER AND SOLDER JOINT FORMATION FOR MICROELECTRONIC PACKAGING |
| title_short |
IMPACT OF FERROMAGNETIC IRON MICRO-SEED IN SAC305 SOLDER AND SOLDER JOINT FORMATION FOR MICROELECTRONIC PACKAGING |
| title_full |
IMPACT OF FERROMAGNETIC IRON MICRO-SEED IN SAC305 SOLDER AND SOLDER JOINT FORMATION FOR MICROELECTRONIC PACKAGING |
| title_fullStr |
IMPACT OF FERROMAGNETIC IRON MICRO-SEED IN SAC305 SOLDER AND SOLDER JOINT FORMATION FOR MICROELECTRONIC PACKAGING |
| title_full_unstemmed |
IMPACT OF FERROMAGNETIC IRON MICRO-SEED IN SAC305 SOLDER AND SOLDER JOINT FORMATION FOR MICROELECTRONIC PACKAGING |
| title_sort |
impact of ferromagnetic iron micro-seed in sac305 solder and solder joint formation for microelectronic packaging |
| publishDate |
2017 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/136799 |
| _version_ |
1821225509431803904 |