أرسل هذا في رسالة قصيرة: SIMULATION OF COPPER ELECTRODEPOSITION FOR HIGH ASPECT RATIO THROUGH- SILICON VIA APPLICATIONS IN THREE- DIMENSIONAL INTEGRATED CIRCUITS

  ______   __   __    _____      ___     ______   
 /_____//  \ \\/ //  |__  //    / _ \\  |      \\ 
 `____ `    \ ` //     / //    / //\ \\ |  --  // 
 /___//      | ||     / //__  |  ___  |||  --  \\ 
 `__ `       |_||    /_____|| |_||  |_|||______// 
 /_//        `-`'    `-----`  `-`   `-` `------`  
 `-`