發送短信 : DEVELOPMENT OF DROP-TEST SIMULATION AND RELIABILITY CHARACTERIZATION FOR IC PACKAGES

  _____     _____     _____    __   __    ______  
 / ____||  |  ___||  |__  //   \ \\/ //  /_   _// 
/ //---`'  | ||__      / //     \ ` //   `-| |,-  
\ \\___    | ||__     / //__     | ||      | ||   
 \_____||  |_____||  /_____||    |_||      |_||   
  `----`   `-----`   `-----`     `-`'      `-`'