發送短信 : DEVELOPMENT OF DROP-TEST SIMULATION AND RELIABILITY CHARACTERIZATION FOR IC PACKAGES

  _____     _____   __    __    ______            
 / ____||  |  ___|| \ \\ / //  /_   _//     ___   
/ //---`'  | ||__    \ \/ //    -| ||-     /   || 
\ \\___    | ||__     \  //     _| ||_    | [] || 
 \_____||  |_____||    \//     /_____//    \__ || 
  `----`   `-----`      `      `-----`      -|_|| 
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