發送短信 : DEVELOPMENT OF DROP-TEST SIMULATION AND RELIABILITY CHARACTERIZATION FOR IC PACKAGES

  ______    _____     _____     ______    _____   
 /_   _//  |  ___||  /  ___||  /_   _//  / ____|| 
 `-| |,-   | ||__   | // __     -| ||-  / //---`' 
   | ||    | ||__   | \\_\ ||   _| ||_  \ \\___   
   |_||    |_____||  \____//   /_____//  \_____|| 
   `-`'    `-----`    `---`    `-----`    `----`