DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW

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Bibliographic Details
Main Author:	MA YIYI
Other Authors:	MECHANICAL & PRODUCTION ENGINEERING
Format:	Theses and Dissertations
Published:	2019
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/158675
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-158675
record_format	dspace
spelling	sg-nus-scholar.10635-1586752024-10-24T20:50:22Z DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW MA YIYI MECHANICAL & PRODUCTION ENGINEERING ANDREW A.O. TAY Master's MASTER OF ENGINEERING 2019-09-16T02:34:29Z 2019-09-16T02:34:29Z 2000 Thesis MA YIYI (2000). DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/158675 CCK BATCHLOAD 20190911
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Master's
author2	MECHANICAL & PRODUCTION ENGINEERING
author_facet	MECHANICAL & PRODUCTION ENGINEERING MA YIYI
format	Theses and Dissertations
author	MA YIYI
spellingShingle	MA YIYI DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW
author_sort	MA YIYI
title	DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW
title_short	DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW
title_full	DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW
title_fullStr	DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW
title_full_unstemmed	DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW
title_sort	delamination propagation in plastic ic packages during solder reflow
publishDate	2019
url	https://scholarbank.nus.edu.sg/handle/10635/158675
_version_	1821201531062452224

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