DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW

Master's

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Bibliographic Details
Main Author:	MA YIYI
Other Authors:	DEPT OF MECHANICAL AND PRODUCTION ENGINEERING
Format:	Theses and Dissertations
Published:	2019
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/159989
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-159989
record_format	dspace
spelling	sg-nus-scholar.10635-1599892019-10-18T05:43:52Z DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW MA YIYI DEPT OF MECHANICAL AND PRODUCTION ENGINEERING ANDREW A.O. TAY Master's MASTER OF ENGINEERING 2019-10-18T05:43:52Z 2019-10-18T05:43:52Z 2000 Thesis MA YIYI (2000). DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/159989 CCK BATCHLOAD 20190911
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Master's
author2	DEPT OF MECHANICAL AND PRODUCTION ENGINEERING
author_facet	DEPT OF MECHANICAL AND PRODUCTION ENGINEERING MA YIYI
format	Theses and Dissertations
author	MA YIYI
spellingShingle	MA YIYI DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW
author_sort	MA YIYI
title	DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW
title_short	DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW
title_full	DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW
title_fullStr	DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW
title_full_unstemmed	DELAMINATION PROPAGATION IN PLASTIC IC PACKAGES DURING SOLDER REFLOW
title_sort	delamination propagation in plastic ic packages during solder reflow
publishDate	2019
url	https://scholarbank.nus.edu.sg/handle/10635/159989
_version_	1681099992916295680

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