NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS

Ph.D

Saved in:

Bibliographic Details
Main Author:	KATTA MOHAN KUMAR
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	nano-particles,lead-free solders,CTE,mechanical properties,microstructure,reliability
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/16554
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-16554
record_format	dspace
spelling	sg-nus-scholar.10635-165542020-11-18T02:58:42Z NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS KATTA MOHAN KUMAR MECHANICAL ENGINEERING TAY AH ONG, ANDREW KRIPESH VAIDYANATHAN nano-particles,lead-free solders,CTE,mechanical properties,microstructure,reliability Ph.D DOCTOR OF PHILOSOPHY 2010-04-08T11:06:27Z 2010-04-08T11:06:27Z 2009-01-02 Thesis KATTA MOHAN KUMAR (2009-01-02). NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/16554 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
language	English
topic	nano-particles,lead-free solders,CTE,mechanical properties,microstructure,reliability
spellingShingle	nano-particles,lead-free solders,CTE,mechanical properties,microstructure,reliability KATTA MOHAN KUMAR NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS
description	Ph.D
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING KATTA MOHAN KUMAR
format	Theses and Dissertations
author	KATTA MOHAN KUMAR
author_sort	KATTA MOHAN KUMAR
title	NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS
title_short	NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS
title_full	NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS
title_fullStr	NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS
title_full_unstemmed	NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS
title_sort	nano-particle reinforced solders for microelectronic interconnect applications
publishDate	2010
url	https://scholarbank.nus.edu.sg/handle/10635/16554
_version_	1684664558843592704

NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS

Similar Items