Development of Lead-Free Nanocomposite Solders for Electronic Packaging

Master's

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Bibliographic Details
Main Author:	PAYMAN BABAGHORBANI
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	Lead-free solder; composite solder; nano copper particulates; mechanical properties
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/16624
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Institution:	National University of Singapore
Language:	English

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record_format	dspace
spelling	sg-nus-scholar.10635-166242017-10-21T06:01:27Z Development of Lead-Free Nanocomposite Solders for Electronic Packaging PAYMAN BABAGHORBANI MECHANICAL ENGINEERING GUPTA, MANOJ Lead-free solder; composite solder; nano copper particulates; mechanical properties Master's MASTER OF ENGINEERING 2010-04-08T11:07:11Z 2010-04-08T11:07:11Z 2008-12-12 Thesis PAYMAN BABAGHORBANI (2008-12-12). Development of Lead-Free Nanocomposite Solders for Electronic Packaging. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/16624 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Lead-free solder; composite solder; nano copper particulates; mechanical properties
spellingShingle	Lead-free solder; composite solder; nano copper particulates; mechanical properties PAYMAN BABAGHORBANI Development of Lead-Free Nanocomposite Solders for Electronic Packaging
description	Master's
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING PAYMAN BABAGHORBANI
format	Theses and Dissertations
author	PAYMAN BABAGHORBANI
author_sort	PAYMAN BABAGHORBANI
title	Development of Lead-Free Nanocomposite Solders for Electronic Packaging
title_short	Development of Lead-Free Nanocomposite Solders for Electronic Packaging
title_full	Development of Lead-Free Nanocomposite Solders for Electronic Packaging
title_fullStr	Development of Lead-Free Nanocomposite Solders for Electronic Packaging
title_full_unstemmed	Development of Lead-Free Nanocomposite Solders for Electronic Packaging
title_sort	development of lead-free nanocomposite solders for electronic packaging
publishDate	2010
url	http://scholarbank.nus.edu.sg/handle/10635/16624
_version_	1681079394107392000

Development of Lead-Free Nanocomposite Solders for Electronic Packaging

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