3D VISUAL INSPECTION OF IC BONDING WIRES

Master's

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Bibliographic Details
Main Author:	HAN XIAO
Other Authors:	ELECTRICAL ENGINEERING
Format:	Theses and Dissertations
Published:	2020
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/174694
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-174694
record_format	dspace
spelling	sg-nus-scholar.10635-1746942020-11-19T13:57:14Z 3D VISUAL INSPECTION OF IC BONDING WIRES HAN XIAO ELECTRICAL ENGINEERING ONG SIM HENG YE QIN ZHONG Master's MASTER OF ENGINEERING 2020-09-08T08:51:24Z 2020-09-08T08:51:24Z 1998 Thesis HAN XIAO (1998). 3D VISUAL INSPECTION OF IC BONDING WIRES. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/174694 CCK BATCHLOAD 20200918
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Master's
author2	ELECTRICAL ENGINEERING
author_facet	ELECTRICAL ENGINEERING HAN XIAO
format	Theses and Dissertations
author	HAN XIAO
spellingShingle	HAN XIAO 3D VISUAL INSPECTION OF IC BONDING WIRES
author_sort	HAN XIAO
title	3D VISUAL INSPECTION OF IC BONDING WIRES
title_short	3D VISUAL INSPECTION OF IC BONDING WIRES
title_full	3D VISUAL INSPECTION OF IC BONDING WIRES
title_fullStr	3D VISUAL INSPECTION OF IC BONDING WIRES
title_full_unstemmed	3D VISUAL INSPECTION OF IC BONDING WIRES
title_sort	3d visual inspection of ic bonding wires
publishDate	2020
url	https://scholarbank.nus.edu.sg/handle/10635/174694
_version_	1686108870277070848

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