Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires

Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires

10.1038/s41598-017-02929-0

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Bibliographic Details
Main Authors: Shen, D, Zhan, Z, Liu, Z, Cao, Y, Zhou, L, Liu, Y, Dai, W, Nishimura, K, Li, C, Lin, C.-T, Jiang, N, Yu, J
Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
Format: Article
Published: Nature Publishing Group 2020
Online Access:https://scholarbank.nus.edu.sg/handle/10635/178612
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Institution: National University of Singapore

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https://scholarbank.nus.edu.sg/handle/10635/178612

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