DEVELOPMENT OF A VARIABLE-ORDER SINGULAR BOUNDARY ELEMENT WITH APPLICATION TO IC PACKAGE ANALYSIS

Master's

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Bibliographic Details
Main Author: LIM KIAN MENG
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Theses and Dissertations
Published: 2020
Online Access:https://scholarbank.nus.edu.sg/handle/10635/178762
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Institution: National University of Singapore
id sg-nus-scholar.10635-178762
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spelling sg-nus-scholar.10635-1787622020-11-19T13:57:28Z DEVELOPMENT OF A VARIABLE-ORDER SINGULAR BOUNDARY ELEMENT WITH APPLICATION TO IC PACKAGE ANALYSIS LIM KIAN MENG MECHANICAL & PRODUCTION ENGINEERING ANDREW A. O. TAY K. H. LEE Master's MASTER OF ENGINEERING 2020-10-21T09:09:13Z 2020-10-21T09:09:13Z 1996 Thesis LIM KIAN MENG (1996). DEVELOPMENT OF A VARIABLE-ORDER SINGULAR BOUNDARY ELEMENT WITH APPLICATION TO IC PACKAGE ANALYSIS. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/178762 CCK BATCHLOAD 20201023
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description Master's
author2 MECHANICAL & PRODUCTION ENGINEERING
author_facet MECHANICAL & PRODUCTION ENGINEERING
LIM KIAN MENG
format Theses and Dissertations
author LIM KIAN MENG
spellingShingle LIM KIAN MENG
DEVELOPMENT OF A VARIABLE-ORDER SINGULAR BOUNDARY ELEMENT WITH APPLICATION TO IC PACKAGE ANALYSIS
author_sort LIM KIAN MENG
title DEVELOPMENT OF A VARIABLE-ORDER SINGULAR BOUNDARY ELEMENT WITH APPLICATION TO IC PACKAGE ANALYSIS
title_short DEVELOPMENT OF A VARIABLE-ORDER SINGULAR BOUNDARY ELEMENT WITH APPLICATION TO IC PACKAGE ANALYSIS
title_full DEVELOPMENT OF A VARIABLE-ORDER SINGULAR BOUNDARY ELEMENT WITH APPLICATION TO IC PACKAGE ANALYSIS
title_fullStr DEVELOPMENT OF A VARIABLE-ORDER SINGULAR BOUNDARY ELEMENT WITH APPLICATION TO IC PACKAGE ANALYSIS
title_full_unstemmed DEVELOPMENT OF A VARIABLE-ORDER SINGULAR BOUNDARY ELEMENT WITH APPLICATION TO IC PACKAGE ANALYSIS
title_sort development of a variable-order singular boundary element with application to ic package analysis
publishDate 2020
url https://scholarbank.nus.edu.sg/handle/10635/178762
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