A STUDY OF WIRE SWEEP DURING TRANSFER MOLDING ON PLASTIC IC PACKAGING

Ph.D

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Bibliographic Details
Main Author: WU JIANHUA
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Theses and Dissertations
Published: 2020
Online Access:https://scholarbank.nus.edu.sg/handle/10635/182237
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Institution: National University of Singapore
id sg-nus-scholar.10635-182237
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spelling sg-nus-scholar.10635-1822372020-11-19T13:57:31Z A STUDY OF WIRE SWEEP DURING TRANSFER MOLDING ON PLASTIC IC PACKAGING WU JIANHUA MECHANICAL & PRODUCTION ENGINEERING TAY ANDREW AH ONG YEO KHOON SENG Ph.D DOCTOR OF PHILOSOPHY 2020-10-30T06:42:21Z 2020-10-30T06:42:21Z 1997 Thesis WU JIANHUA (1997). A STUDY OF WIRE SWEEP DURING TRANSFER MOLDING ON PLASTIC IC PACKAGING. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/182237 CCK BATCHLOAD 20201023
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description Ph.D
author2 MECHANICAL & PRODUCTION ENGINEERING
author_facet MECHANICAL & PRODUCTION ENGINEERING
WU JIANHUA
format Theses and Dissertations
author WU JIANHUA
spellingShingle WU JIANHUA
A STUDY OF WIRE SWEEP DURING TRANSFER MOLDING ON PLASTIC IC PACKAGING
author_sort WU JIANHUA
title A STUDY OF WIRE SWEEP DURING TRANSFER MOLDING ON PLASTIC IC PACKAGING
title_short A STUDY OF WIRE SWEEP DURING TRANSFER MOLDING ON PLASTIC IC PACKAGING
title_full A STUDY OF WIRE SWEEP DURING TRANSFER MOLDING ON PLASTIC IC PACKAGING
title_fullStr A STUDY OF WIRE SWEEP DURING TRANSFER MOLDING ON PLASTIC IC PACKAGING
title_full_unstemmed A STUDY OF WIRE SWEEP DURING TRANSFER MOLDING ON PLASTIC IC PACKAGING
title_sort study of wire sweep during transfer molding on plastic ic packaging
publishDate 2020
url https://scholarbank.nus.edu.sg/handle/10635/182237
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