Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model
10.1109/TCPMT.2019.2926792
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sg-nus-scholar.10635-1833942024-04-25T03:31:48Z Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model GAO SIPING Francesco de Paulis LIU ENXIAO GUO YONGXIN ELECTRICAL AND COMPUTER ENGINEERING 10.1109/TCPMT.2019.2926792 IEEE Transactions on Components, Packaging and Manufacturing Technology 2020-11-12T01:31:59Z 2020-11-12T01:31:59Z 2019-07-04 Article GAO SIPING, Francesco de Paulis, LIU ENXIAO, GUO YONGXIN (2019-07-04). Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model. IEEE Transactions on Components, Packaging and Manufacturing Technology. ScholarBank@NUS Repository. https://doi.org/10.1109/TCPMT.2019.2926792 21563950 https://scholarbank.nus.edu.sg/handle/10635/183394 CC0 1.0 Universal http://creativecommons.org/publicdomain/zero/1.0/ IEEE |
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10.1109/TCPMT.2019.2926792 |
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ELECTRICAL AND COMPUTER ENGINEERING |
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ELECTRICAL AND COMPUTER ENGINEERING GAO SIPING Francesco de Paulis LIU ENXIAO GUO YONGXIN |
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GAO SIPING Francesco de Paulis LIU ENXIAO GUO YONGXIN |
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GAO SIPING Francesco de Paulis LIU ENXIAO GUO YONGXIN Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model |
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GAO SIPING |
title |
Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model |
title_short |
Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model |
title_full |
Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model |
title_fullStr |
Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model |
title_full_unstemmed |
Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model |
title_sort |
transmission line representation of the capacitive via-plate interaction toward a capacitor-free via model |
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IEEE |
publishDate |
2020 |
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https://scholarbank.nus.edu.sg/handle/10635/183394 |
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