Dynamic material characterisation of solder interconnects in microelectronic packaging

Master's

Saved in:

Bibliographic Details
Main Author:	ONG KAI CHUAN
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2011
Subjects:	Lead-free solder, Eutectic Sn-37Pb solder, Dynamic material response, Cooling rate, microstructure, Split Hopkinson Pressure Bar.
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/18878
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-18878
record_format	dspace
spelling	sg-nus-scholar.10635-188782017-10-21T07:51:23Z Dynamic material characterisation of solder interconnects in microelectronic packaging ONG KAI CHUAN MECHANICAL ENGINEERING LIM CHWEE TECK TAN BENG CHYE, VINCENT Lead-free solder, Eutectic Sn-37Pb solder, Dynamic material response, Cooling rate, microstructure, Split Hopkinson Pressure Bar. Master's MASTER OF ENGINEERING 2011-01-05T18:00:28Z 2011-01-05T18:00:28Z 2006-01-24 Thesis ONG KAI CHUAN (2006-01-24). Dynamic material characterisation of solder interconnects in microelectronic packaging. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/18878 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Lead-free solder, Eutectic Sn-37Pb solder, Dynamic material response, Cooling rate, microstructure, Split Hopkinson Pressure Bar.
spellingShingle	Lead-free solder, Eutectic Sn-37Pb solder, Dynamic material response, Cooling rate, microstructure, Split Hopkinson Pressure Bar. ONG KAI CHUAN Dynamic material characterisation of solder interconnects in microelectronic packaging
description	Master's
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING ONG KAI CHUAN
format	Theses and Dissertations
author	ONG KAI CHUAN
author_sort	ONG KAI CHUAN
title	Dynamic material characterisation of solder interconnects in microelectronic packaging
title_short	Dynamic material characterisation of solder interconnects in microelectronic packaging
title_full	Dynamic material characterisation of solder interconnects in microelectronic packaging
title_fullStr	Dynamic material characterisation of solder interconnects in microelectronic packaging
title_full_unstemmed	Dynamic material characterisation of solder interconnects in microelectronic packaging
title_sort	dynamic material characterisation of solder interconnects in microelectronic packaging
publishDate	2011
url	http://scholarbank.nus.edu.sg/handle/10635/18878
_version_	1681079576707465216

Dynamic material characterisation of solder interconnects in microelectronic packaging

Similar Items