Analysis of bus ride comfort using smartphone sensor data
10.32604/cmc.2019.05664
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Main Authors: | Chin, H.-C., Pang, X., Wang, Z. |
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Other Authors: | INSTITUTE OF SYSTEMS SCIENCE |
Format: | Article |
Published: |
Tech Science Press
2021
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Online Access: | https://scholarbank.nus.edu.sg/handle/10635/212119 |
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Institution: | National University of Singapore |
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