TRADE CONFLICTS AND TECHNOLOGICAL INNOVATION: EVIDENCE FROM EXPORTING FIRMS IN CHINA

Ph.D

Saved in:

Bibliographic Details
Main Author:	GE YEYANRAN
Other Authors:	INDUSTRIAL SYSTEMS ENGINEERING & MGT
Format:	Theses and Dissertations
Language:	English
Published:	2022
Subjects:	Anti-dumping sanctions,U.S.–China trade conflict,learning-by-exporting,innovation, patents
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/235597
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-235597
record_format	dspace
spelling	sg-nus-scholar.10635-2355972022-12-19T18:00:26Z TRADE CONFLICTS AND TECHNOLOGICAL INNOVATION: EVIDENCE FROM EXPORTING FIRMS IN CHINA GE YEYANRAN INDUSTRIAL SYSTEMS ENGINEERING & MGT Guang-Lih Huang Anti-dumping sanctions,U.S.–China trade conflict,learning-by-exporting,innovation, patents Ph.D DOCTOR OF PHILOSOPHY (CDE-ENG) 2022-12-19T18:00:26Z 2022-12-19T18:00:26Z 2022-08-01 Thesis GE YEYANRAN (2022-08-01). TRADE CONFLICTS AND TECHNOLOGICAL INNOVATION: EVIDENCE FROM EXPORTING FIRMS IN CHINA. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/235597 en
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
language	English
topic	Anti-dumping sanctions,U.S.–China trade conflict,learning-by-exporting,innovation, patents
spellingShingle	Anti-dumping sanctions,U.S.–China trade conflict,learning-by-exporting,innovation, patents GE YEYANRAN TRADE CONFLICTS AND TECHNOLOGICAL INNOVATION: EVIDENCE FROM EXPORTING FIRMS IN CHINA
description	Ph.D
author2	INDUSTRIAL SYSTEMS ENGINEERING & MGT
author_facet	INDUSTRIAL SYSTEMS ENGINEERING & MGT GE YEYANRAN
format	Theses and Dissertations
author	GE YEYANRAN
author_sort	GE YEYANRAN
title	TRADE CONFLICTS AND TECHNOLOGICAL INNOVATION: EVIDENCE FROM EXPORTING FIRMS IN CHINA
title_short	TRADE CONFLICTS AND TECHNOLOGICAL INNOVATION: EVIDENCE FROM EXPORTING FIRMS IN CHINA
title_full	TRADE CONFLICTS AND TECHNOLOGICAL INNOVATION: EVIDENCE FROM EXPORTING FIRMS IN CHINA
title_fullStr	TRADE CONFLICTS AND TECHNOLOGICAL INNOVATION: EVIDENCE FROM EXPORTING FIRMS IN CHINA
title_full_unstemmed	TRADE CONFLICTS AND TECHNOLOGICAL INNOVATION: EVIDENCE FROM EXPORTING FIRMS IN CHINA
title_sort	trade conflicts and technological innovation: evidence from exporting firms in china
publishDate	2022
url	https://scholarbank.nus.edu.sg/handle/10635/235597
_version_	1753801060766449664

TRADE CONFLICTS AND TECHNOLOGICAL INNOVATION: EVIDENCE FROM EXPORTING FIRMS IN CHINA

Similar Items