Development of a novel method in electroless copper plating

Master's

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Bibliographic Details
Main Author:	SENG SWEE SONG
Other Authors:	CHEMICAL & BIOMOLECULAR ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2011
Subjects:	Electroless copper, Chelating agents, Stabilizers, Surfactants, Plating rate,Surface morphology
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/27783
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-27783
record_format	dspace
spelling	sg-nus-scholar.10635-277832015-09-23T19:40:10Z Development of a novel method in electroless copper plating SENG SWEE SONG CHEMICAL & BIOMOLECULAR ENGINEERING CHEN JIAPING Electroless copper, Chelating agents, Stabilizers, Surfactants, Plating rate,Surface morphology Master's MASTER OF ENGINEERING 2011-10-18T18:00:47Z 2011-10-18T18:00:47Z 2004-09-27 Thesis SENG SWEE SONG (2004-09-27). Development of a novel method in electroless copper plating. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/27783 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Electroless copper, Chelating agents, Stabilizers, Surfactants, Plating rate,Surface morphology
spellingShingle	Electroless copper, Chelating agents, Stabilizers, Surfactants, Plating rate,Surface morphology SENG SWEE SONG Development of a novel method in electroless copper plating
description	Master's
author2	CHEMICAL & BIOMOLECULAR ENGINEERING
author_facet	CHEMICAL & BIOMOLECULAR ENGINEERING SENG SWEE SONG
format	Theses and Dissertations
author	SENG SWEE SONG
author_sort	SENG SWEE SONG
title	Development of a novel method in electroless copper plating
title_short	Development of a novel method in electroless copper plating
title_full	Development of a novel method in electroless copper plating
title_fullStr	Development of a novel method in electroless copper plating
title_full_unstemmed	Development of a novel method in electroless copper plating
title_sort	development of a novel method in electroless copper plating
publishDate	2011
url	http://scholarbank.nus.edu.sg/handle/10635/27783
_version_	1681080620993740800

Development of a novel method in electroless copper plating

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