Laser precision engineering of glass substrates

• Main Authors: Lan, B., Hong, M.-H., Ye, K.-D., Wang, Z.-B., Cheng, S.-X., Chong, T.-C.
• 其他作者: ELECTRICAL & COMPUTER ENGINEERING
• 格式: Article
• 出版: 2013
• 主題: Ablation depth; Cracks; Glass; Laser ablation; Pocket scanning method
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/43074

10.1143/JJAP.43.7102