Thermal analysis of packaging device with metal-coated fiber bragg grating

• Main Authors: Xu, B., He, W., Ng, L., Liu, M., Yuan, G., Yuan, H., An, C., Chong, T.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Fiber Bragg (FBG); Packaging device; Temprature distribution; Time response
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/51266
• Institution: National University of Singapore

10.1117/12.528688