Thermal analysis of packaging device with metal-coated fiber bragg grating

• Main Authors: Xu, B., He, W., Ng, L., Liu, M., Yuan, G., Yuan, H., An, C., Chong, T.
• 其他作者: ELECTRICAL & COMPUTER ENGINEERING
• 格式: Conference or Workshop Item
• 出版: 2014
• 主題: Fiber Bragg (FBG); Packaging device; Temprature distribution; Time response
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/51266

10.1117/12.528688