A molecular dynamics study of the effect of voids on the deformation behavior of nanocrystalline copper

10.1155/2007/64589

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Bibliographic Details
Main Authors: Zheng, C., Zhang, Y.-W.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/54437
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Institution: National University of Singapore
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Summary:10.1155/2007/64589