APA引文

Oo, Z., Liu, E., Li, E., Wei, X., Zhang, Y., Tan, M., . . . ENGINEERING, E. &. C. (2014). A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias.

Chicago Style Citation

Oo, Z.Z., E.-X Liu, E.-P Li, X. Wei, Y. Zhang, M. Tan, L.-W.J Li, R. Vahldieck, and ELECTRICAL & COMPUTER ENGINEERING. A Semi-analytical Approach for System-level Electrical Modeling of Electronic Packages With Large Number of Vias. 2014.

MLA引文

Oo, Z.Z., et al. A Semi-analytical Approach for System-level Electrical Modeling of Electronic Packages With Large Number of Vias. 2014.