A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias

A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias

10.1109/TADVP.2008.923379

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Bibliographic Details
Main Authors: Oo, Z.Z., Liu, E.-X., Li, E.-P., Wei, X., Zhang, Y., Tan, M., Li, L.-W.J., Vahldieck, R.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Subjects:
Electronic package
Modal expansion
Power integrity
Signal integrity
System-level modeling
Online Access:http://scholarbank.nus.edu.sg/handle/10635/54802
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/54802

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