A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias

10.1109/TADVP.2008.923379

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書目詳細資料
Main Authors:	Oo, Z.Z., Liu, E.-X., Li, E.-P., Wei, X., Zhang, Y., Tan, M., Li, L.-W.J., Vahldieck, R.
其他作者:	ELECTRICAL & COMPUTER ENGINEERING
格式:	Article
出版:	2014
主題:	Electronic package Modal expansion Power integrity Signal integrity System-level modeling
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/54802
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

實物特徵
總結:	10.1109/TADVP.2008.923379

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