A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias

10.1109/TADVP.2008.923379

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Bibliographic Details
Main Authors:	Oo, Z.Z., Liu, E.-X., Li, E.-P., Wei, X., Zhang, Y., Tan, M., Li, L.-W.J., Vahldieck, R.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Article
Published:	2014
Subjects:	Electronic package Modal expansion Power integrity Signal integrity System-level modeling
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/54802
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-54802
record_format	dspace
spelling	sg-nus-scholar.10635-548022023-10-30T21:53:06Z A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias Oo, Z.Z. Liu, E.-X. Li, E.-P. Wei, X. Zhang, Y. Tan, M. Li, L.-W.J. Vahldieck, R. ELECTRICAL & COMPUTER ENGINEERING Electronic package Modal expansion Power integrity Signal integrity System-level modeling 10.1109/TADVP.2008.923379 IEEE Transactions on Advanced Packaging 31 2 267-274 ITAPF 2014-06-17T02:35:41Z 2014-06-17T02:35:41Z 2008-05 Article Oo, Z.Z., Liu, E.-X., Li, E.-P., Wei, X., Zhang, Y., Tan, M., Li, L.-W.J., Vahldieck, R. (2008-05). A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias. IEEE Transactions on Advanced Packaging 31 (2) : 267-274. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2008.923379 15213323 http://scholarbank.nus.edu.sg/handle/10635/54802 000258768300004 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Electronic package Modal expansion Power integrity Signal integrity System-level modeling
spellingShingle	Electronic package Modal expansion Power integrity Signal integrity System-level modeling Oo, Z.Z. Liu, E.-X. Li, E.-P. Wei, X. Zhang, Y. Tan, M. Li, L.-W.J. Vahldieck, R. A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias
description	10.1109/TADVP.2008.923379
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Oo, Z.Z. Liu, E.-X. Li, E.-P. Wei, X. Zhang, Y. Tan, M. Li, L.-W.J. Vahldieck, R.
format	Article
author	Oo, Z.Z. Liu, E.-X. Li, E.-P. Wei, X. Zhang, Y. Tan, M. Li, L.-W.J. Vahldieck, R.
author_sort	Oo, Z.Z.
title	A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias
title_short	A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias
title_full	A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias
title_fullStr	A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias
title_full_unstemmed	A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias
title_sort	semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/54802
_version_	1781412027612266496

A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias

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