A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias

• Main Authors: Oo, Z.Z., Liu, E.-X., Li, E.-P., Wei, X., Zhang, Y., Tan, M., Li, L.-W.J., Vahldieck, R.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Article
• Published: 2014
• Subjects: Electronic package; Modal expansion; Power integrity; Signal integrity; System-level modeling
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/54802
• Institution: National University of Singapore

10.1109/TADVP.2008.923379