Yu, D., Lee, C., Yan, L., Choi, W., Yu, A., Lau, J., & ENGINEERING, E. &. C. (2014). The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization.
استشهاد بنمط شيكاغوYu, D.-Q., C. Lee, L.L Yan, W.K Choi, A. Yu, J.H Lau, و ELECTRICAL & COMPUTER ENGINEERING. The Role of Ni Buffer Layer On High Yield Low Temperature Hermetic Wafer Bonding Using In/Sn/Cu Metallization. 2014.
MLA استشهادYu, D.-Q., et al. The Role of Ni Buffer Layer On High Yield Low Temperature Hermetic Wafer Bonding Using In/Sn/Cu Metallization. 2014.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.