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 __   __   __   __   _    _    __   __    ______  
 \ \\/ //  \ \\/ // | |  | ||  \ \\/ //  /_   _// 
  \   //    \ ` //  | |/\| ||   \ ` //     | ||   
  / . \\     | ||   |  /\  ||    | ||     _| ||   
 /_//\_\\    |_||   |_// \_||    |_||    /__//    
 `-`  --`    `-`'   `-`   `-`    `-`'    `--`

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Text this: Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization