Estimation of size and depth of debonds in laminates from holographic interferometry

Journal of Engineering Materials and Technology, Transactions of the ASME

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Bibliographic Details
Main Authors: Shang, H.M., Lim, E.M., Lim, K.B.
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/58259
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Institution: National University of Singapore