Cai, M., Li, X., Rahman, M., & ENGINEERING, M. (2014). Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear.
استشهاد بنمط شيكاغوCai, M.B., X.P Li, M. Rahman, و MECHANICAL ENGINEERING. Characteristics of "dynamic Hard Particles" in Nanoscale Ductile Mode Cutting of Monocrystalline Silicon With Diamond Tools in Relation to Tool Groove Wear. 2014.
MLA استشهادCai, M.B., X.P Li, M. Rahman, و MECHANICAL ENGINEERING. Characteristics of "dynamic Hard Particles" in Nanoscale Ductile Mode Cutting of Monocrystalline Silicon With Diamond Tools in Relation to Tool Groove Wear. 2014.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.