Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear

10.1016/j.wear.2006.11.030

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Bibliographic Details
Main Authors: Cai, M.B., Li, X.P., Rahman, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59684
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Institution: National University of Singapore