Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon

by Cai, M.B., Li, X.P., Rahman, M.
Published 2014

Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation

by Cai, M.B., Li, X.P., Rahman, M.
Published 2014

Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation

by Cai, M.B., Li, X.P., Rahman, M.
Published 2014

Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear

by Cai, M.B., Li, X.P., Rahman, M.
Published 2014

Molecular dynamics simulation of the effect of tool edge radius on cutting forces and cutting region in nanoscale ductile cutting of silicon

by Cai, M.B., Li, X.P., Rahman, M.
Published 2014

High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer

by Cai, M.B., Li, X.P., Rahman, M.
Published 2014

Crack initiation in relation to the tool edge radius and cutting conditions in nanoscale cutting of silicon

by Cai, M.B., Li, X.P., Rahman, M., Tay, A.A.O.
Published 2014

The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer

by Arefin, S., Li, X.P., Cai, M.B., Rahman, M., Liu, K., Tay, A.
Published 2014

Effect of crystalline orientation of a diamond tool on the machined surface in ductile mode cutting of silicon

by Li, X.P., Cai, M.B., Neo, W.C.L., Sean, K.H.W.
Published 2014