The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer

The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer

10.1243/09544054JEM568

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Bibliographic Details
Main Authors: Arefin, S., Li, X.P., Cai, M.B., Rahman, M., Liu, K., Tay, A.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Cutting edge radius
Ductile mode cutting
Molecular dynamics simulation
Silicon wafer
Subsurface damage
Online Access:http://scholarbank.nus.edu.sg/handle/10635/51657
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/51657

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