The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer

10.1243/09544054JEM568

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Bibliographic Details
Main Authors:	Arefin, S., Li, X.P., Cai, M.B., Rahman, M., Liu, K., Tay, A.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Subjects:	Cutting edge radius Ductile mode cutting Molecular dynamics simulation Silicon wafer Subsurface damage
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/51657
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-51657
record_format	dspace
spelling	sg-nus-scholar.10635-516572024-11-14T16:34:28Z The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer Arefin, S. Li, X.P. Cai, M.B. Rahman, M. Liu, K. Tay, A. MECHANICAL ENGINEERING Cutting edge radius Ductile mode cutting Molecular dynamics simulation Silicon wafer Subsurface damage 10.1243/09544054JEM568 Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 221 2 213-220 PIBME 2014-04-24T10:18:04Z 2014-04-24T10:18:04Z 2007 Conference Paper Arefin, S., Li, X.P., Cai, M.B., Rahman, M., Liu, K., Tay, A. (2007). The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 221 (2) : 213-220. ScholarBank@NUS Repository. https://doi.org/10.1243/09544054JEM568 09544054 http://scholarbank.nus.edu.sg/handle/10635/51657 000246880000008 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Cutting edge radius Ductile mode cutting Molecular dynamics simulation Silicon wafer Subsurface damage
spellingShingle	Cutting edge radius Ductile mode cutting Molecular dynamics simulation Silicon wafer Subsurface damage Arefin, S. Li, X.P. Cai, M.B. Rahman, M. Liu, K. Tay, A. The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer
description	10.1243/09544054JEM568
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Arefin, S. Li, X.P. Cai, M.B. Rahman, M. Liu, K. Tay, A.
format	Conference or Workshop Item
author	Arefin, S. Li, X.P. Cai, M.B. Rahman, M. Liu, K. Tay, A.
author_sort	Arefin, S.
title	The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer
title_short	The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer
title_full	The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer
title_fullStr	The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer
title_full_unstemmed	The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer
title_sort	effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/51657
_version_	1821211219272400896

The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer

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