Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation

Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation

10.1016/j.jmatprotec.2007.04.028

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Bibliographic Details
Main Authors: Cai, M.B., Li, X.P., Rahman, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Cutting force
Ductile mode cutting
Molecular dynamics
Silicon wafer
Stress
Temperature
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61407
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/61407

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