Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation

Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation

10.1016/j.jmatprotec.2007.04.028

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Bibliographic Details
Main Authors: Cai, M.B., Li, X.P., Rahman, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Cutting force
Ductile mode cutting
Molecular dynamics
Silicon wafer
Stress
Temperature
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61407
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Institution: National University of Singapore
id sg-nus-scholar.10635-61407
record_format dspace
spelling sg-nus-scholar.10635-614072024-11-13T23:27:49Z Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation Cai, M.B. Li, X.P. Rahman, M. MECHANICAL ENGINEERING Cutting force Ductile mode cutting Molecular dynamics Silicon wafer Stress Temperature 10.1016/j.jmatprotec.2007.04.028 Journal of Materials Processing Technology 192-193 607-612 JMPTE 2014-06-17T06:34:43Z 2014-06-17T06:34:43Z 2007-10-01 Article Cai, M.B., Li, X.P., Rahman, M. (2007-10-01). Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation. Journal of Materials Processing Technology 192-193 : 607-612. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jmatprotec.2007.04.028 09240136 http://scholarbank.nus.edu.sg/handle/10635/61407 000249314100096 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Cutting force
Ductile mode cutting
Molecular dynamics
Silicon wafer
Stress
Temperature
spellingShingle Cutting force
Ductile mode cutting
Molecular dynamics
Silicon wafer
Stress
Temperature
Cai, M.B.
Li, X.P.
Rahman, M.
Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
description 10.1016/j.jmatprotec.2007.04.028
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Cai, M.B.
Li, X.P.
Rahman, M.
format Article
author Cai, M.B.
Li, X.P.
Rahman, M.
author_sort Cai, M.B.
title Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
title_short Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
title_full Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
title_fullStr Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
title_full_unstemmed Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
title_sort study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/61407
_version_ 1821186261591785472

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