Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation

10.1016/j.jmatprotec.2007.04.028

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Bibliographic Details
Main Authors:	Cai, M.B., Li, X.P., Rahman, M.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Cutting force Ductile mode cutting Molecular dynamics Silicon wafer Stress Temperature
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/61407
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-61407
record_format	dspace
spelling	sg-nus-scholar.10635-614072023-10-25T23:21:42Z Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation Cai, M.B. Li, X.P. Rahman, M. MECHANICAL ENGINEERING Cutting force Ductile mode cutting Molecular dynamics Silicon wafer Stress Temperature 10.1016/j.jmatprotec.2007.04.028 Journal of Materials Processing Technology 192-193 607-612 JMPTE 2014-06-17T06:34:43Z 2014-06-17T06:34:43Z 2007-10-01 Article Cai, M.B., Li, X.P., Rahman, M. (2007-10-01). Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation. Journal of Materials Processing Technology 192-193 : 607-612. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jmatprotec.2007.04.028 09240136 http://scholarbank.nus.edu.sg/handle/10635/61407 000249314100096 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Cutting force Ductile mode cutting Molecular dynamics Silicon wafer Stress Temperature
spellingShingle	Cutting force Ductile mode cutting Molecular dynamics Silicon wafer Stress Temperature Cai, M.B. Li, X.P. Rahman, M. Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
description	10.1016/j.jmatprotec.2007.04.028
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Cai, M.B. Li, X.P. Rahman, M.
format	Article
author	Cai, M.B. Li, X.P. Rahman, M.
author_sort	Cai, M.B.
title	Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
title_short	Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
title_full	Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
title_fullStr	Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
title_full_unstemmed	Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
title_sort	study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/61407
_version_	1781782044063301632

Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation

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