Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon

Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon

10.1115/1.2673567

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Bibliographic Details
Main Authors: Cai, M.B., Li, X.P., Rahman, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Microgroove wear
Molecular dynamics
Nanogroove wear
Nanoscale ductile mode cutting
Silicon wafer
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61404
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/61404

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