Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon
10.1115/1.2673567
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Main Authors: | Cai, M.B., Li, X.P., Rahman, M. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/61404 |
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Institution: | National University of Singapore |
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