A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries
10.1007/s00170-012-3937-2
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| Main Authors: | , , |
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| 格式: | Review |
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2014
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| 在線閱讀: | http://scholarbank.nus.edu.sg/handle/10635/68099 |
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| 機構: | National University of Singapore |