A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries

10.1007/s00170-012-3937-2

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Bibliographic Details
Main Authors: Arif, M., Rahman, M., San, W.Y.
Other Authors: MECHANICAL ENGINEERING
Format: Review
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/68099
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-680992023-10-25T22:49:41Z A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries Arif, M. Rahman, M. San, W.Y. MECHANICAL ENGINEERING Ductile-mode machining Silicon machining Silicon wafers Ultraprecision machining 10.1007/s00170-012-3937-2 International Journal of Advanced Manufacturing Technology 63 5-8 481-504 IJATE 2014-06-18T06:09:44Z 2014-06-18T06:09:44Z 2012-11 Review Arif, M., Rahman, M., San, W.Y. (2012-11). A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries. International Journal of Advanced Manufacturing Technology 63 (5-8) : 481-504. ScholarBank@NUS Repository. https://doi.org/10.1007/s00170-012-3937-2 02683768 http://scholarbank.nus.edu.sg/handle/10635/68099 000310320800005 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Ductile-mode machining
Silicon machining
Silicon wafers
Ultraprecision machining
spellingShingle Ductile-mode machining
Silicon machining
Silicon wafers
Ultraprecision machining
Arif, M.
Rahman, M.
San, W.Y.
A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries
description 10.1007/s00170-012-3937-2
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Arif, M.
Rahman, M.
San, W.Y.
format Review
author Arif, M.
Rahman, M.
San, W.Y.
author_sort Arif, M.
title A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries
title_short A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries
title_full A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries
title_fullStr A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries
title_full_unstemmed A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries
title_sort state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/68099
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