A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries
10.1007/s00170-012-3937-2
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| Main Authors: | , , |
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| Other Authors: | |
| Format: | Review |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/68099 |
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| Institution: | National University of Singapore |
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