Crack initiation in relation to the tool edge radius and cutting conditions in nanoscale cutting of silicon

Crack initiation in relation to the tool edge radius and cutting conditions in nanoscale cutting of silicon

10.1016/j.ijmachtools.2006.05.006

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Bibliographic Details
Main Authors: Cai, M.B., Li, X.P., Rahman, M., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Crack
Molecular dynamics
Nanoscale cutting
Silicon wafer
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59813
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/59813

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