Crack initiation in relation to the tool edge radius and cutting conditions in nanoscale cutting of silicon

• Main Authors: Cai, M.B., Li, X.P., Rahman, M., Tay, A.A.O.
• Other Authors: MECHANICAL ENGINEERING
• Format: Article
• Published: 2014
• Subjects: Crack; Molecular dynamics; Nanoscale cutting; Silicon wafer
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/59813
• Institution: National University of Singapore

10.1016/j.ijmachtools.2006.05.006