Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon

• Main Authors: Cai, M.B., Li, X.P., Rahman, M.
• Other Authors: MECHANICAL ENGINEERING
• Format: Article
• Published: 2014
• Subjects: Microgroove wear; Molecular dynamics; Nanogroove wear; Nanoscale ductile mode cutting; Silicon wafer
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/61404
• Institution: National University of Singapore

10.1115/1.2673567