Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon

10.1115/1.2673567

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Bibliographic Details
Main Authors:	Cai, M.B., Li, X.P., Rahman, M.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Microgroove wear Molecular dynamics Nanogroove wear Nanoscale ductile mode cutting Silicon wafer
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/61404
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-61404
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spelling	sg-nus-scholar.10635-614042023-10-26T07:08:09Z Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon Cai, M.B. Li, X.P. Rahman, M. MECHANICAL ENGINEERING Microgroove wear Molecular dynamics Nanogroove wear Nanoscale ductile mode cutting Silicon wafer 10.1115/1.2673567 Journal of Manufacturing Science and Engineering, Transactions of the ASME 129 2 281-286 2014-06-17T06:34:41Z 2014-06-17T06:34:41Z 2007-04 Article Cai, M.B., Li, X.P., Rahman, M. (2007-04). Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon. Journal of Manufacturing Science and Engineering, Transactions of the ASME 129 (2) : 281-286. ScholarBank@NUS Repository. https://doi.org/10.1115/1.2673567 10871357 http://scholarbank.nus.edu.sg/handle/10635/61404 000246431100007 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Microgroove wear Molecular dynamics Nanogroove wear Nanoscale ductile mode cutting Silicon wafer
spellingShingle	Microgroove wear Molecular dynamics Nanogroove wear Nanoscale ductile mode cutting Silicon wafer Cai, M.B. Li, X.P. Rahman, M. Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon
description	10.1115/1.2673567
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Cai, M.B. Li, X.P. Rahman, M.
format	Article
author	Cai, M.B. Li, X.P. Rahman, M.
author_sort	Cai, M.B.
title	Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon
title_short	Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon
title_full	Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon
title_fullStr	Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon
title_full_unstemmed	Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon
title_sort	study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/61404
_version_	1781782043045134336

Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon

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