Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear

Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear

10.1016/j.wear.2006.11.030

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Bibliographic Details
Main Authors: Cai, M.B., Li, X.P., Rahman, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Dynamic hard particles
Groove wear
Molecular dynamics
Nanoscale cutting
Silicon
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59684
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Institution: National University of Singapore
id sg-nus-scholar.10635-59684
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spelling sg-nus-scholar.10635-596842023-10-25T21:38:04Z Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear Cai, M.B. Li, X.P. Rahman, M. MECHANICAL ENGINEERING Dynamic hard particles Groove wear Molecular dynamics Nanoscale cutting Silicon 10.1016/j.wear.2006.11.030 Wear 263 7-12 SPEC. ISS. 1459-1466 WEARA 2014-06-17T06:14:23Z 2014-06-17T06:14:23Z 2007-09-10 Article Cai, M.B., Li, X.P., Rahman, M. (2007-09-10). Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear. Wear 263 (7-12 SPEC. ISS.) : 1459-1466. ScholarBank@NUS Repository. https://doi.org/10.1016/j.wear.2006.11.030 00431648 http://scholarbank.nus.edu.sg/handle/10635/59684 000249754500077 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Dynamic hard particles
Groove wear
Molecular dynamics
Nanoscale cutting
Silicon
spellingShingle Dynamic hard particles
Groove wear
Molecular dynamics
Nanoscale cutting
Silicon
Cai, M.B.
Li, X.P.
Rahman, M.
Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear
description 10.1016/j.wear.2006.11.030
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Cai, M.B.
Li, X.P.
Rahman, M.
format Article
author Cai, M.B.
Li, X.P.
Rahman, M.
author_sort Cai, M.B.
title Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear
title_short Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear
title_full Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear
title_fullStr Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear
title_full_unstemmed Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear
title_sort characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/59684
_version_ 1781781679865593856

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